Fifteen million euros. That is the size of the Series A Tusk IC disclosed on September 17 — and its investors say it is enough to move the costliest part of a satellite internet terminal onto the same commodity silicon that already powers a car's radar.

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Tusk IC builds what it calls the first standard complementary metal-oxide-semiconductor (CMOS) beamformer chips for Ka-band satellite links — a lower-cost, lower-power alternative to the gallium arsenide and silicon germanium parts inside today's flat-panel antennas.

The €15 million round, led by Matterwave Ventures, FORWARD.one and the Flanders Future Tech Fund, closed two months after a European Space Agency contract to push those chips into volume production.

The bet sits on the ground, not in orbit. Cheaper terminals decide how many of the low and medium Earth orbit constellations now launching can sell service at a profit.

Tusk IC designs millimetre-wave integrated circuits (ICs) in Antwerp. KU Leuven spun the company out in 2018, and for most of its life it sold engineering work and high-frequency measurement services. The satellite business is the part it now wants to industrialise.

A small round that stands out in Flanders

€15M Series A, Sept 2026

Series A round

Led by Matterwave Ventures, FORWARD.one and the Flanders Future Tech Fund, managed by PMV. · Dealroom, 2026

For a Belgian hardware company, the round runs large. Dealroom, the Amsterdam-based data provider, ranks it above the 90th percentile for comparable Series A deals in the country and values it at $17.2 million. The leads are specialists: Matterwave Ventures of Munich, the Dutch deep-tech fund FORWARD.one, and the Flanders Future Tech Fund, managed by PMV, the Flemish regional investment company. The Schaubroeck family joined them, alongside existing backers.

Vincent Hebbelynck, who heads technology venture capital at PMV, tied the deal to place rather than product.

Flanders has built a strong ecosystem at the intersection of semiconductors and space technology.— Vincent Hebbelynck, Head of Tech VC, PMV

The company spent eight years building millimetre-wave expertise inside a region that hosts both a chip cluster and a space industry. A €15 million round meant to connect the two reads less like a venture novelty than like industrial policy with a return target attached.

The half of satellite internet nobody prices

Satellite broadband has two halves. The first is the constellation — Starlink, Amazon's Leo, Europe's publicly funded IRIS². The second is the ground segment: the flat-panel antenna on a roof, a plane or a ship, pointing an electronic beam at a satellite crossing the sky. Ka-band, the high-frequency radio band operators use for high-capacity links, makes that beam harder to hold and the electronics behind it more valuable.

Electronic steering needs no moving parts. It needs an array of small antenna elements, each fed by a radio-frequency chip that shifts phase and controls amplitude. That chip, the beamformer, concentrates a terminal's semiconductor value. Builders have traditionally made it on gallium arsenide or specialty silicon germanium, both harder and pricier to manufacture than the mainstream bulk CMOS used for ordinary logic.

Its claim is that the beamformer can be built in that mainstream CMOS. If it holds, it changes cost and supply at once: bulk CMOS runs on high-volume lines that exist in dozens of fabs, not a handful of specialty processes. The company also points to record-low energy consumption — a real constraint, because a terminal's heat budget tracks how much power its electronics burn.

A chip with a European mandate

The commercial turn is recent. On July 6, Tusk IC announced an industrial contract from the European Space Agency (ESA), backed by BELSPO, Belgium's federal science policy office. It sits inside ARTES, ESA's Advanced Research in Telecommunications Systems programme, under a line the agency calls Industrial Competitiveness.

The mandate is narrow and unglamorous: take the ConnectKa chips and ConnecTile modules through design optimisation, qualification testing, pilot production and the start of volume manufacturing. ESA is funding the middle of the pipeline — the stretch between a working prototype and a part a customer can order in quantity.

By supporting Tusk IC's pioneering solution with record-low energy consumption and fabricated in mass-volume chip technology, ESA is demonstrating its commitment to strengthening Europe's competitiveness in satellite communications.— Constantin Siriteanu, Telecommunication Systems Engineer, ESA

The subtext is sovereignty. Europe is funding IRIS², its own secure constellation, while its terminal makers still lean on specialty chips and component suppliers concentrated outside the bloc. Moving the beamformer onto commodity silicon keeps one more layer of that stack inside Europe — and, in principle, cheaper.

Who buys the chip, and who else builds it

The buyer rarely sits at the consumer end. The company sells to the companies that build flat-panel antennas and satellite user terminals, which sell on to operators and integrators. Its modules serve low, medium and geostationary orbits — the three bands of altitude that different services occupy.

Three rivals matter. Sivers Semiconductors, listed in Stockholm, sells Ka-band beamforming chipsets. EnSilica, based in Britain, has taken ESA-backed orders for a digital beamformer aimed at broadband terminals. All three chase the same upgrade cycle: as low and medium Earth orbit constellations enter commercial service, the terminals that connect to them scale with the fleet.

What a beamformer does, in one paragraph

A phased array steers radio energy without moving. Each element in the array needs its own phase and amplitude setting; the beamformer applies those settings so the energy adds up in one direction and cancels in others. In silicon, that lets a flat panel lock onto a satellite while the satellite moves and the panel stays still.

What the investor is actually buying

The headline figure matters less than what it funds. A €15 million round buys a transition from prototype to volume production at a company that has already cleared an ESA qualification path. That sequence de-risks the technology, and hardware investors pay for exactly that.

The risks look just as concrete. The business runs fabless: it designs chips and pays a foundry to build them, so margins hinge on how much cost it can design out and how much pricing power it holds against Sivers and EnSilica. Pilot production is where deep-tech firms stall — yields, qualification and customer test cycles drain cash before revenue lands. The terminal market also tracks constellation capex, which carries its own history of delays.

As we wrote in September, the bottleneck in the space economy has moved from orbit to the ground. Satellites are launching; the terminals that make them worth launching are the constraint. A €15 million Series A aimed at the most expensive chip in that terminal is a small round attached to a very large question.

Will standard CMOS become the default beamformer process by 2029?

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By 2029, at least one major flat-panel antenna maker will design a volume Ka-band terminal around standard-CMOS beamformers rather than silicon germanium.

Probability: 55% — the cost and supply argument is strong, but space-hardware qualification cycles run in years, not quarters.

✅ Arguments for

An ESA product-phase contract awarded in 2026 put the beamformer design on the agency's qualification path.

Standard CMOS taps high-volume fabs and removes the specialty-substrate bottleneck on cost and capacity.

Every new low-orbit constellation adds terminal demand that rewards a cheaper bill of materials.

Confirmation criteria: a named volume customer and a moving production line by 2028.

❌ Arguments against

Silicon germanium and gallium arsenide still hold performance headroom at high frequencies that bulk CMOS struggles to match, especially for transmit power.

Incumbent suppliers carry years of design-in inertia with terminal makers.

A single qualification failure can push volume adoption past the 2029 window.

Disconfirmation criteria: terminal makers reordering SiGe parts for the next terminal generation.
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Key signals to track

Whether management lands a first volume customer for the ConnectKa or ConnecTile modules.

Whether Sivers or EnSilica answers with a standard-CMOS part of its own.

Whether ESA extends the ARTES product phase into a second, larger tranche.

Whether a flat-panel antenna maker publicly designs a terminal around CMOS beamformers.

Development scenarios

🟢 Optimistic scenario (30%)

A European terminal maker qualifies the CMOS beamformer first, and ESA follows with a larger product-phase tranche.

Implications: Revenue moves from one-off engineering work to recurring chip sales, and Flanders holds the design inside the bloc.

🟡 Base-case scenario (50%)

Qualification stretches into 2028 and the first volume design lands for a niche or government-linked terminal.

Implications: The technology proves out slowly, and the €15 million carries the company through the gap without changing the wider supply chain.

🔴 Pessimistic scenario (20%)

Transmit-power limits keep CMOS in receive-only roles, and SiGe incumbents hold the volume sockets.

Implications: Tusk IC survives as a design house, and Europe's terminal layer stays dependent on specialty parts.
Belgium's Tusk IC raises €15M to mass-produce satellite chips
Dealroom's deal note pegs the round at $17.2 million and places it above the 90th percentile for comparable Belgian Series A deals.
The percentile ranking is the cleanest available read on how large this round is for its category.
TUSK IC raises €15m to advance satellite communications technology
Trade coverage with investor commentary from FORWARD.one and PMV, plus the company's claim to the first standard-CMOS Ka-band beamformers.
Useful for the investor quotes and the precise product framing.
Antwerp-based TUSK IC secures €15 million for Ka-band chips
Background on the KU Leuven spin-out and its shift from millimetre-wave services to satellite chips and modules.
Best short account of where the company came from and why the round matters.